Foil composite card

ABSTRACT

Composite cards formed in accordance with the invention include a security layer comprising a hologram or diffraction grating formed at, or in, the center, or core layer, of the card. The hologram may be formed by embossing a designated area of the core layer with a diffraction pattern and depositing a thin layer of metal on the embossed layer. Additional layers may be selectively and symmetrically attached to the top and bottom surfaces of the core layer. A laser may be used to remove selected portions of the metal formed on the embossed layer, at selected stages of forming the card, to impart a selected pattern or information to the holographic region. The cards may be ‘lasered’ when the cards being processed are attached to, and part of, a large sheet of material, whereby the “lasering” of all the cards on the sheet can be done at the same time and relatively inexpensively. Alternatively, each card may be individually “lasered” to produce desired alpha numeric information, bar codes information or a graphic image, after the sheets are die-cut into cards.

This application is a continuation application of my co-pendingapplication Ser. No. 12/006,168 filed Dec. 31, 2007 and titled FoilComposite Card, the contents of which are incorporated herein byreference.

BACKGROUND OF THE INVENTION

The invention is directed to the manufacture of a multi-layered(composite) card, or any like instrument or document.

The term “card” or “cards” as used herein, and in the appended claims,is intended to include a large variety of documents and instruments suchas a financial cards, identification (including a National ID orDriver's License) cards, electronic passport pages, gift cards,documents for holding permanent and long lasting records such as medicalrecords or security cards, or other plastic cards used for promotion ofa product or organization.

Various means of producing an improved composite card are disclosed inU.S. Pat. No. 6,644,552, titled Composite Card and issued to JohnHerslow, the applicant of this application, the teachings of which areincorporated herein by reference. However, there remains a demand forincreasing the security of the cards (documents and/or instruments)being formed and used. For example, FIG. 4 of the '552 patent, showssecurity elements formed in a top layer 17 and FIG. 6 of the '552 patentdiscusses the addition of holographic material and other securityindicia after the sheets are cut into standard cards.

Thus, to increase the security of a card, it is known to form hologramson the card. Generally, the holograms may be formed by a hot stampingmethod at, or near, the top (or bottom) surface (level) of the card. Adisadvantage to so placing the holograms is that a counterfeiter may beable to alter the card without the tampering being readily apparent tosomeone examining or accepting the card. Also, positioning the hologramclose to the top or the bottom surface of the card creates an asymmetryin its construction, whereby, when the temperature varies, differentportions (layers) of the card may be placed under different degrees oftension and contraction resulting in stresses which tend to distort thecard and/or the hologram (e.g., the card fails to remain flat). Stillfurther, when the hologram is placed at, or near, the top or the bottomsurfaces it may be easily and inadvertently scratched or marred.

Due to the highly sensitive nature of the “secure” cards, of interest,it is critical that they be made tamper resistant and sturdy and to lastfor a long time (e.g., more than 5 years) even where high temperaturelevels (hot or cold) and a high degree of humidity are encountered. Itis also desirable that they be relatively inexpensive to fabricate and,very importantly, that the card be virtually impossible to be alteredwithout destroying the card or the easy detection of the alteration.

SUMMARY OF THE INVENTION

Accordingly, composite cards formed in accordance with the inventioninclude a security layer formed at the center, or core layer, of thecards. Cards embodying the invention may include a hologram, ordiffraction grating formed at, or in, the center, or core layer, of thecard with symmetrical layers formed above and below the center or corelayer.

A hologram may be formed by embossing a designated area of the corelayer with a diffraction pattern and vapor depositing a very thin layerof metal or metal compound (e.g., aluminum, zinc sulfide, etc . . . ) onthe embossed layer. Then, additional layers are selectively attached tothe top and bottom surfaces of the core layer. In accordance with theinvention, for each additional layer attached to the top surface of thecore layer there is a corresponding like layer attached to the bottomsurface of the core layer for producing a highly symmetrical structure(sandwich).

In accordance with one embodiment of the invention, all the layers aremade of a clear synthetic (e.g., plastic) material, whereby the patternformed on, or within, the core layer may be seen by looking down at thetop of the card or by looking up at the bottom of the card.

The layer of metal or metal compound deposited on the core layer may bemade very thin to provide a “see-through” effect, under appropriatelight conditions. However, where the layer of metal or metal compounddeposited on the core layer is of “standard” thickness, the pattern mayonly be seen from the top or the bottom side of the core.

After the hologram is formed, a laser may be used to remove selectedportions of the metal formed on the embossed layer to impart a selectedpattern or information to the holographic region. In accordance with theinvention, this step in making a card or a set of cards may be performedwhen the card or cards being processed are attached to, and part of, alarge sheet of material, whereby the “lasering” of all the cards on thesheet can be done at the same time and relatively inexpensively.

In accordance with the invention a hologram may be formed in the coreportion of card and if the hologram includes a metal layer, laserequipment may be used to modify and/or alter the metal pattern atselected stages in the process of forming the card. Alternatively, afterthe sheets are die-cut into cards, each card may be individually“lasered” to produce desired alpha numeric information, bar codesinformation or a graphic image.

Embodiments of the invention may include the use of a polyester film, orany other carrier, which includes a metallic or a high refractive index(HRI) transparent holographic foil that is pre-laminated between twosheets of a material (which could be PVC, PET or other thermo-plasticresin) that has a thermo-plastic adhesive (which may have, but notnecessarily has, been previously applied). The pre-laminated holographicfoil can have an unlimited number of patterns and may also be configuredto include one, or several individual, hologram designs repeated in rowsand columns across an entire sheet. The holographic design may also havethe appearance of full metal, or partial metal and partial whitecoverage (white reflecting hologram) on each individual card in thematrix. Utilizing this holographic foil pre-laminate in concert withstandard plastic card materials, enables a plastic card manufacturer toproduce “full-face” foil pattern design cards, or “full-face” registeredhologram cards.

These cards would include the holographic foil pre-laminate as thecenter sheet in a standard card composition. Utilizing the center sheetcomposition with a metal layer, the subsequent plastic card could belaser engraved using a standard YAG laser or any other suitable laser,thus removing the metal or material coatings of the holographic layer inone or more of the following: an alpha numeric, barcode or graphicdesign. The end result is an inexpensive foil composite card that has aunique individualized holographic layer that has been permanentlyaltered.

If a potential counterfeiter attempted to disassemble the card in orderto compromise the integrity of the information contained on, or in, thecard, it would cause a change in the hologram resulting in the hologrambeing irreparably damaged. Therefore, plastic cards formed in accordancewith the invention are truly tamper resistant and are more secure foilcards than any of the known commercially available cards.

BRIEF DESCRIPTION OF THE DRAWINGS

In the accompanying drawings (which are not drawn to scale) likereference characters denote like components, and:

FIG. 1 is a cross sectional diagram of part of a card (instrument)embodying the invention;

FIG. 2 is a diagram detailing some of the steps in forming a cardembodying the invention;

FIG. 2A is a diagram detailing the application of an embossing layer toa core layer to form a card embodying the invention;

FIG. 3 is a cross sectional diagram of part of a card embodying theinvention where the core layer includes a transparent material having ahigh refractive index;

FIGS. 3a, 3b, 3c, 3d , are cross sectional diagrams of steps in forminga card embodying the invention;

FIG. 4 is a diagram of the cross section of part of a card embodying theinvention to which a laser beam is applied to form an additional ablatedpattern in a metal layer in accordance with the invention;

FIG. 5 is a diagram of a top view of a card including a holographicportion formed in accordance with the invention;

FIG. 6 is a cross sectional diagram of a card shown in FIG. 5 where alllayers are made of clear (transparent) materials;

FIG. 6A is a cross sectional diagram of a card embodying the inventionwhere one, or more, of the layers block the light;

FIG. 7 is a top view of a sheet containing an array of cardsillustrating that a laser beam can be applied to all of the cards on thesheet;

FIG. 8 is a cross sectional diagram of a card with an integrated circuit(IC) chip and antenna embodying the invention;

FIG. 9 is a cross sectional diagram of a dual interface card embodyingthe invention;

FIG. 10 is a cross sectional diagram of a card with a lasered windowembodying the invention;

FIG. 11 is a cross sectional diagram of another card with a laseredwindow embodying the invention; and

FIG. 12 is a cross sectional diagram of still another card with alasered window embodying the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIGS. 1, 2 and 2A, there is shown a core 20 comprised of abase layer 21 of a plastic material, which may be, for example, orientedpolyester terephthalate (OPET) or polypropylene, or polystyrene, or anynumber of acrylics and/or a combination of these materials. The baselayer 21 is shown to have an upper surface 21 a and a lower, or bottom,surface 21 b. For purpose of illustration, a pattern is shown to beformed on, or above, surface 21 a of layer 21. However it should beunderstood that, alternatively, the pattern could be formed on surface21 b. Two different methods of forming a pattern are shown in FIGS. 2and 2A. The surface 21 a of layer 21 in FIG. 2 is embossed with adiffractive or holographic pattern. In FIG. 2A, the surface 21 a oflayer 21 is coated with an embossing layer 200 which is then embossedwith a diffractive pattern, 200 a.

A layer 22 of aluminum (or any suitable metal or metal compound such asZinc Sulfide) may then be vapor deposited on the diffraction pattern toform a hologram. The use of vapor deposition is very significant in thatit permits a very thin layer 22, a few atoms thick, to be formed onsurface 21 a and thus complete the formation of the hologram, usingsmall amounts of metal. Using vapor deposition, the thickness of thelayer can be made very thin so it is nearly transparent and can providea “see-through” effect. Alternatively, the metal layer can be made alittle thicker so as to be more opaque.

As detailed in step 3 of FIG. 2, a clear adhesive primer layer 23 a, maybe coated over the patterned and metallized top surface (21 a) and asimilar clear adhesive primer layer 23 b may be coated over the bottomsurface (21 b) of the layer 21. The core 20 is completed by attachingthese clear adhering layer (23 a, 23 b) above and below the embossedbase layer 21. The clear layer 23 a, 23 b, is a primer coating. It maybe polyethyleneamine or an acrylic based, or other, organic adhesivecompound with solvent or water based carriers. The primer coatings 23 a,23 b are fairly thin and yet fairly strong/sturdy. They also function topromote adhesion to layers 24 a, 24 b which are attached to the core 20.

As detailed in step 4 of FIG. 2 clear PE adhesive layers 24 a, 24 b maythen be formed/attached to the top (outer) surfaces of theirrespectively layers 23 a, 23 b. Layers 24 a, 24 b may be of polyethylene(PE) material, or polypropylene (PP), or high density polypropylene(HDPP), or ethylene Vinyl Acetate (EVA), or any of the different formsof PET or any of like materials, or mixtures of these materials. Theclear materials used to form layers 24 a, 24 b may contain other clearadhesion promoting compounds (e.g., ethyl acrylates, acrylic acid, etc .. . ). The layers 24 a, 24 b may be fairly thick and function to attachto the thin embossed hologram layer and coatings of core 20. Forhandling purposes, buffer layers 25 a, 25 b may then be formed/attachedto the top (outer) surfaces of layers 24 a, 24 b to complete what isdefined as subassembly 30. For example, buffer (carrier) layer (25 a, 25b) may be laminated to the top and bottom of adhesive layers 24 a, 24 b.Subassembly 30, is thick enough to be handled by automatic credit cardmanufacturing equipment.

In one embodiment, the base layer 21 was approximately 0.002 inchesthick and the adhesive backed layers (23 a, 23 b) were each made to beapproximately 0.0001 to 0.0003 inches thick. In other embodiments thelayers 23 a, 23 b could be made either thinner or much thicker.

In still other embodiments, adhesive layers can be coated over thebuffer or carrier layer and the two (i.e., the carrier and buffer layerson each side of a holographic layer) can be combined with theholographic layer. That is, adhesive can be applied to either side ofthe carrier foil interface and then pre-laminated together (3 sheetslaminated to become one laminate; i.e., the prelaminate prior to platenlamination. Thus, the carrier sheet can hold the sub-assemblies fortransfer to substrates for forming cards.

Examining FIG. 2 in greater detail note some of the steps used informing the core 20.

As shown, for example, in step 1, the base component may be a sheet 21of plastic (e.g., PET or OPET or polypropylene, or polystyrene, orpolymethyl, methacrylate, etc . . . ) material whose thickness typicallyranges from 0.0005 inches to more than 0.005 inches. In one embodimentlayer 21 was made, for example, 0.002 inches thick.

Then, as shown in step 2A, which may be termed an embossing step, adiffraction pattern may be formed on one side of layer 21. A diffractionpattern may be formed directly in the plastic layer 21 by embossing(e.g., stamping) pattern(s) therein. Forming the pattern in a sheet ofplastic (or in an embossing layer, as discussed below) is easier andless wearing on the embossing (stamping) equipment than forming a likepattern in a metal layer.

Then, as shown in step 2B a hologram is formed on one surface (21 a) ofplastic sheet 21 by vapor deposition of a metal layer (e.g., aluminumonto the diffraction pattern. Thus, the hologram may be formed byembossing the top surface 21 a to form a diffraction pattern and thenmetallizing the pattern. The surface 21 a may be coated by the vapordeposition of aluminum (or similar light reflective materials such asnickel, silver, zinc, or other like materials). A significant advantageof using vapor deposition (although many other methods may be used) isthat very small amounts of the metal (light reflective material) need tobe used to form the hologram resulting in a significant savings in thecost of manufacturing the card (or instrument). Also, very thin layersallow a controllable amount of light to pass through. This enables themanufacture of a card, or document, in which an image (hologram) formedon a card is reflected (i.e., is visible) while also enabling a viewerto “see-through” the image.

Then, as shown in step 3 of FIG. 2, clear adhesive or “primer” coats 23a, 23 b may be applied to the top and bottom surfaces 21 a, 21 b,respectively, of plastic sheet 21. The primer coat also functions tofill in the ridges resulting from the formation of the diffractiongrating. The clear layers 23 a, 23 b which may be of the type describedabove, may be attached to the top and bottom surfaces of “embossed”plastic sheet 21 on which the aluminum has been vapor deposited. Primerlayers 23 a, 23 b may be attached to base layer 21 by any one of anumber of methods, such as, for example, gravure coating, rollercoating, flexography or other like methods. The primer secures the bondto both sides of the holographic sheet (the embossed side and the blankside). This completes the formation of what is defined herein as thecore assembly 20.

Then, as shown in step 4 of FIG. 2, the PE layers 24 a, 24 b, or anyother suitable layer, as noted above, which function as an additionalbuffer between that bond and the outer buffer layers 25 a, 25 b areattached to the core assembly. The PE layers 24 a, 24 b may also includean adhesive which promotes adhesion to the clear primer layers 23 a, 23b attached to the top and bottom surfaces of layer 21. Layers 24 a, 24b, 25 a, 25 b may be attached to each other and to the underlying layersby any one of a number of methods such as, for example, platenlamination, hot roll lamination, liquid adhesive lamination.

Thus, as shown in step 4 of FIG. 2, a clear buffer layer 25 a isattached to the PE layer 24 a and a clear buffer layer 25 b is attachedto the PE adhesive layer 24 b. All of layers 24 a and 24 b and layers 25a, 25 b function as buffers, providing additional strength to thestructure and at the same time protecting the hologram from beingdamaged or tampered with. Adding layers 25 a and 25 b completes thesub-assembly 30 which may then be customized to form cards withadditional information.

By forming the hologram at, and within, the core level, the hologramwill not be easily, or inadvertently, damaged since several additionallayers will be attached to the top and bottom of the holographic layer.It is also not subject to easily being tampered or altered. Forming thehologram at the center of the structure minimizes the possibility oftampering while fully protecting the hologram. Another significantadvantage of forming the hologram at the core of the structure is thatthe top and bottom surfaces stay flat due to equal shrinking and/orexpansion of all the layers. Note that the card structure is formed soas to be symmetrical about the core layer.

FIG. 2A illustrates another method of forming the hologram. As shown inStep 1A of FIG. 2A, a clear embossing layer 200 may be coated directlyover a layer 21 (or 210). Alternatively, a primer coating may be formedon layer 21/210 and then the embossing layer 200 may attached/formed tothe primer coating. The embossing layer may be composed, for example, ofsiloxane, acrylic, vinyl, linear polyester, urethane or any likematerials and may be several (e.g., less than 0.5 to more than 5)microns thick. The embossing layers may also be deposited as liquids andradiation cured, possibly in two steps—first as a soft easily embossablecoating which then becomes hard and impervious. As shown in step 2A ofFIG. 2A, a diffraction pattern is embossed (formed) in the embossinglayer/coating 200 to form a desired pattern. Forming a pattern in theembossing layer may be desirable since it is even easier and lesswearing on the embossing (stamping) equipment than forming a likepattern directly in the PET layer (as per FIG. 2). After the pattern isembossed on and within the embossing layer 200, the sheet may beprocessed as per steps 2B, 3 and 4 shown in FIG. 2.

[Note that a hologram may be formed by, for example, embossing a patternin a carrier base material (e.g., a hard polyester) or by embossing thepattern in a coating previously applied to the carrier base material, orby embossing the pattern in a metal which was previously deposited ontothe base carrier material or by depositing the metal onto a soft coatingand then embossing.]

Referring back to FIG. 1, note that the core 20 may be part of asubassembly 30 which includes attaching layers 24 a, 24 b of clear PEand buffer layers 25 a, 25 b to the top and bottom surfaces of the core20. Layers 25 a, 25 b, may range in thickness from 0.001 to 0.005inches, or more, and may be composed of PVC like materials.

The subassembly 30 may then be used to form a card, or any instrument,by attaching a layer 27 a, 27 b of clear or white PVC material to thetop and bottom surfaces of the subassembly 30. As illustrated in FIG. 1,information can be printed either on the outer surface (the surfacefacing away form the core) of layers 27 a, 27 b or on the inner surfaceor both. The printed information may include, for example, fixed datafields and advertising, and/or any other desired information. The card(or instrument) may be completed by adding clear PVC laminating films 29a, 29 b to the top and bottom surfaces of the card.

FIG. 3 is a cross-sectional diagram (not to scale) of a card embodyingthe invention. FIG. 3 includes a core comprised of a layer 210 which maybe (but not be) of the same material as layer 21. In FIG. 3, the topsurface 210 a of layer 210 is embossed with a diffraction pattern givinga unique pattern to the structure. A high refractive index (HRI) layer212 can then be vapor deposited on the embossed layer. Due to the HRIproperty of layer 212, there is no need to further metallize the layer.The HRI layer may be formed of zinc sulfide or zinc oxide or anymaterial having like properties. Clear primer layer 23 a is attached tothe top of HRI layer 212 overlying layer 210 and primer layer 23 b isattached to the bottom of layer 210.

Then, as shown in FIG. 1, clear layers 24 a and 24 b, which may be of PEor any other suitable materials, are attached to layers 23 a and 23 b,respectively and additional layers (25 a, 25 b) of clear (translucent)material may be attached to the top and bottom layers of layers 24 a, 24b to form the subassembly 30. Additional layers 27 a, 27 b may beattached to the top and bottom layers of the sub-assembly. Informationmay be written or printed in any known manner on, or in, the layers 27a, 27 b. Subsequently, laminating films 29 a, 29 b, may be attached tothe top and bottom intermediate layers 27 a, 27 b to produce a card 40whose core contents can not be altered without essentially destroyingthe card.

FIGS. 3A, 3B, 3C, 3D and 3E illustrate the forming/coating of anembossing layer 200 on stock (e.g., PET) material 210 (FIG. 3A), thenembossing layer 200 with a diffraction pattern 200 a (FIG. 3B), thenvapor depositing an HRI layer 212 a on the diffraction pattern (FIG.3C), then coating clear primer layers 23 a, 23 b above layer 212 a andbelow layer 210 (FIG. 3D) to form a core assembly 20. Then clear PEadhesive layer 24 a is formed above prime layer 23 a and clear PEadhesive layer 24 b, is formed below layer 23 b (FIG. 3E). Note that thesteps and thicknesses of the layers to form the basic structuresdiscussed above are summarized in Table I, below.

FIG. 4 includes a cross-sectional diagram (not to scale) of a portion ofa card embodying the invention, which may be part of a sheet (not shown)on which a large number of cards are formed, and depicts a piece oflaser equipment 410 for “lasering” (e.g., engraving or vaporizing) metallayer 22. The core assembly 20 is shown to have a layer 22 of aluminumdeposited and embossed as discussed for FIGS. 1, 2, and 2A, above.Portions of the metal layer may be vaporized (see sections 401 a, 401 b,401 c) by the laser equipment 410 such that portions of the metal areselectively removed or “ablated” by “lasering” (e.g., eliminating orvaporizing) the metal to form any number of different patterns (e.g.,graphic as well as alpha numeric information may be generated). Theclear layers 29 a, 27 a, 25 a and 24 a may be selected to be transparentto the laser wavelength. Consequently, the laser beam can pass throughthe clear layers of the card to “write” on the holographic layer belowthe top surface of the card. The laser 410 may be applied at severaldifferent stages of the card manufacturing process to form the desiredpatterns. Thus, the laser may be applied to “write” on the metal layerafter the core 20 is formed and before the attachment of the carrierlayers 24 a, 24 b and 25 a, 25 b. Alternatively, the laser 410 may beapplied to form the desired pattern in the metal layer after the layers24 a, 24 b, and 25 a, 25 b are attached to the core layer, and beforelayers 27 a and 27 b are attached. Still further, the laser may beapplied to form the desired pattern in the metal layer after the layers27 a, 27 b are attached and before the layer 29 a, 29 b, are attached.Finally, the laser may be applied to form the desired pattern in themetal layer after the layers 29 a, 29 b are attached, when the cards maybe part of a full sheet or in individual card shape.

FIG. 5 shows a top view of a card 100 illustrating that the hologram maybe located within a designated window or area 101, shown in portion 601.Alternatively the hologram may extend the full length and/or width ofthe card 100. Note that alpha numeric information may be produced bylasering within the holographic layer (e.g., layer 22 in FIG. 4 shown inportion 602). Also, alpha numeric information may be produced byprinting information on, or within, layers 27 a, 27 b, as discussedabove.

FIG. 6 is a cross-sectional diagram (not to scale) of card 100 of FIG. 5and is intended to show that the layers above and below the holographiclayer, 21, 22/212, may be transparent or translucent to yield a“see-through” card with the hologram portion 601 and the lasered portion602 being visible from the top side or from the bottom side of the card.Note that if layers 27 a, 27 b are made of a white material a brightlight may be needed to observe the “see-through” effect.

FIG. 6A is a cross-sectional diagram (not to scale) intended to showthat the layers above the holographic layer 21, 22/212, may betransparent or translucent so the holographic pattern may be seen fromthe top. At the same time, one or more of the layers below theholographic layer (e.g., 27 b or 29 b) may be opaque so as to block thehologram from being seen from the bottom. Making the top portion of thecard transparent and the bottom portion opaque is by way of illustrationand the reverse could be done instead.

FIG. 7 shows the application of a laser beam generated by laserequipment 410 to a sheet 5 containing a large array of cards 100 insheet form embodying the invention. The laser may be applied to theentire sheet of cards which may be at the core stage, the sub-assemblystage, or any of the stages thereafter. Being able to apply the laserbeam in this manner, at any time before the cards are separated from asheet, is economically advantageous and saves much in the cost ofhandling and also adds significant additional security.

FIG. 8 illustrates that cards embodying the invention, shown in thevarious figures, may be modified by the addition of a semiconductor chipcontaining selected electronic circuits (an integrated circuit, IC)within the body of the card in, or within, a layer 30 dedicated toinclude an antenna carrier, with the antenna being connected to the chipmodule. This enables the manufacture of a radio frequency identification(RFID) card. Note that the metal layer 22/212 can act as a radiofrequency shield to reduce reception from that side of the RFID antenna.

FIG. 9 illustrates that the chip (IC) and an antenna and carrier may beformed within a layer of the card and that, in addition, the chip may beaccessed (read) by providing an external contact 901 along one side ofthe card. This type of card may be referred to as a dual interface cardsince it enables information on the card to be read or written via RFIDand contact.

FIG. 10 illustrates that a window or opening can be formed by laseringthrough the metal layer within core layer 20 to enable the color orpattern of an underlying layer (e.g., 27 b) to be seen from the top sideof the card. Lasering through the metal layer forms (or opens) a windowexposing an underlying layer (e.g., 27 b) which may be black or white orcolored or be of any preset pattern.

FIG. 11 illustrates that a window or opening can be formed by laseringthe metal layer within core layer 20 to enable a preprinted image formedon an underlying layer (e.g., 27 b) to be seen from the top side of thecard. Here again lasering through the metal layer forms a windowenabling the seeing or reading of a pre-printed pattern on an underlyinglayer (e.g., 27 b).

FIG. 12 illustrates that a window or opening can be formed by laseringthrough the metal layer within core layer 20 to provide a “see-through”condition. That is, lasering through the metal layer forms a windowwhich provides visibility through both sides (top and bottom) of thecard. This may be viewed by applying a light source such as a flashlightin direct contact with one side of the card and viewing the lightpattern on the other side.

TABLE I Example of Steps and materials in forming core, sub assembly andcard step I II III IV 1 Start with Start with Start with Start withbase/central base/central layer base/central base/central layer 21/21021 of PET/OPET layer 21/210 layer 21 of of PET/OPET material material ofPET/OPET PET/OPET material material 1A Deposit Deposit embossing layerembossing 200 on one surface of layer 200 on layer 21/210 one surface oflayer 21/210 2 Emboss one surface Emboss top Emboss one Emboss topsurface of of base layer 21 with surface of surface of base embossinglayer 200 pattern embossing layer 21 with with pattern 200a layer 200with pattern pattern 200a 3 Vapor deposition of Vapor Vapor Vapordeposition of HRI metal 22 on pattern deposition of deposition ofcoating 212 on pattern metal 22 on HRI coating 212 pattern on pattern 4Apply clear primer Apply clear Apply clear Apply primer clear coatscoats 23a, 23b to primer coats primer coats 23a, 23b to top and top andbottom 23a, 23b to top 23a, 23b to top bottom Where primer Thickness:and bottom and bottom coat 23a, 23b .00002-.0002 Thickness: Thickness:Thickness: .00002-.0002 .00002-.0002 .00002-.0002 5. Form clear PE Formclear PE Form clear PE Form clear PE adhesive adhesive layers 24a,adhesive layers adhesive layers layers 24a, 24b fairly 24b-fairly thick,24a, 24b fairly 24a, 24b fairly thick, sticky sticky thick, stickythick, sticky Thickness: Thickness: Thickness: Thickness: .0005-.005.0005-.005 .0005-.005 .0005-.005 6. Form clear buffer Form clear Formclear Form clear buffer layer layer 25a, 25b of buffer layer bufferlayer 25a, 25b of PVC material PVC material 25a, 25b of 25a, 25b ofthickness thickness PVC material PVC material .0008-.005 .0008-.005thickness thickness .0008-.005 .0008-.005 7. Form clear white Form clearForm clear Form clear white PVC PVC layer white PVC white PVC layerwhite PVC layer layer 27a, 27b layer 27a, 27b 27a, 27b 27a, 27bThickness .004 to .012 Thickness .004 to Thickness .004 Thickness .004.012 to .012 to .012 8. Form PVC Form PVC Form PVC Form PVC laminatinglaminating film 29a, laminating film laminating film film 29a, 29b 29b29a, 29b 29a, 29b Thickness .0008 to .005 Thickness .0008 to ThicknessThickness .005 .0008 to .005_(—) .0008 to .005 All dimensions in inches

What is claimed is:
 1. A multilayered composite card comprising: a baseplastic layer having top and bottom surfaces; an embossed metallic layerhaving an embossed pattern formed on the top surface of said baseplastic layer; first and second clear primer layers; said first clearprimer layer attached to the embossed metallic layer and the secondclear primer layer attached to the bottom surface of the base plasticlayer; wherein a central core region of said multilayered composite cardis defined by said first clear primer layer, said embossed metalliclayer, said base plastic layer, and said second clear primer layer;first and second buffer layers; said first buffer layer attached to saidfirst clear primer layer and said second buffer layer disposed betweensaid second clear primer layer and a carrier layer; and said carrierlayer comprising an integrated circuit (IC) containing electroniccircuitry connected to an antenna configured to enable contactless radiofrequency (RF) communication, wherein said embossed metallic layer actsas a radio frequency shield that reduces wireless receptivity of theantenna from a side of the antenna facing the embossed metallic layerand includes at least one window formed within the embossed pattern. 2.The multilayered composite card as claimed in claim 1 wherein said atleast one window formed in the embossed metallic layer is formed bylasering the metallic layer.
 3. The multilayered composite card asclaimed in claim 1, wherein said carrier layer is a plastic layer;further including first and second additional plastic layers, the firstadditional plastic layer attached to the first buffer layer and thesecond additional plastic layer attached to the carrier layer, andgraphic material printed on selected ones of said carrier layer, saidbase plastic layer or said first or second additional plastic layers. 4.The multilayered composite card as claimed in claim 1, further includingan electrical contact assembly on one side of the multilayered compositecard in electrical communication with the IC and operative to enable theIC to be accessed by direct contact via said contact assembly.
 5. Themultilayered composite card as claimed in claim 1, wherein said embossedmetallic layer has one or more patterns.
 6. The multilayered compositecard as claimed in claim 1, wherein said embossed metallic layer isdisposed on said base plastic layer, a first buffer plastic layer isdisposed above said embossed metallic layer, and a second buffer plasticlayer is formed below said base plastic layer, and wherein said carrierlayer comprises a plastic layer attached to the second buffer plasticlayer formed below the base plastic layer.
 7. The multilayered compositecard of claim 1, further comprising a plastic layer having informationselectively written thereon, and the at least one window is formedwithin the embossed pattern to enable visibility of the selectedinformation.
 8. The multilayered composite card of claim 1 furthercomprising a first clear plastic layer having information selectivelywritten thereon, and which is attached to the first buffer layer; and asecond clear plastic layer having information selectively writtenthereon, and which is attached to the second buffer layer, wherein theat least one window is formed within the embossed pattern to enablevisibility of the information.
 9. A card comprising: a core subassembly;a plurality of additional layers stacked with, and attached to, saidcore subassembly; an integrated circuit (IC) containing selectedelectronic circuits mounted on, or within, one of said plurality ofadditional layers; an antenna located on, or within, one of saidplurality of additional layers, said antenna connected to said IC andconfigured to enable contactless radio frequency communication with anexternal device; and wherein the core subassembly comprises an embossedmetallic layer having an embossed pattern formed on a top surface of abase plastic layer, wherein said embossed metallic layer includes atleast one window formed within the embossed pattern, and acts as a radiofrequency shield that reduces wireless receptivity of the antenna from aside of the antenna facing the embossed metallic layer.
 10. The card asclaimed in claim 9, wherein the at least one window is a laser-formedwindow.
 11. A multilayered composite card comprising: a base plasticlayer having top and bottom surfaces; an embossed metallic layer with apredetermined embossed pattern formed within the top surface of saidbase plastic layer; first and second clear primer layers, said firstclear primer layer attached to the embossed metallic layer and thesecond clear primer layer attached to the bottom surface of the baseplastic layer, wherein a central core region of said multilayeredcomposite card is defined by said first clear primer layer, saidembossed metallic layer, said base plastic layer, and said second clearprimer layer; a first set of additional protective and buffer layers anda second set of additional protective and buffer layers; said first setattached to the first clear primer layer and the second set attached tothe second clear primer layer; and a carrier layer mounted within saidsecond set, said carrier layer including an integrated circuit (IC)containing electronic circuitry connected to an antenna configured toenable contactless radio frequency (RF) communication, wherein saidembossed metallic layer acts as a radio frequency shield that reduceswireless receptivity of the antenna from a side of the antenna facingthe embossed metallic layer and includes at least one window formedwithin the embossed pattern.